Henkel and CITC forge partnership
Henkel has partnered with the Chip Integration Technology Center (CITC) in the Netherlands to formalize a collaboration agreement on the development of high-temperature chip bonding solutions for radio frequency (RF) and power electronics. Under the terms of the partnership, Henkel will provide commercialized and in-development pressureless sinter die attachment formulations and CITC will provide material testing and analysis in next-generation packaging designs.
CITC’s high-performance thermal packaging program focuses on thermomechanical design strategies and device packaging platforms that incorporate low-stress, high-reliability interconnect solutions. Since fixture materials and die casting materials are often limiting factors for optimal operation of RF and power packages, Henkel is the ideal partner for innovation in this application area.
In addition to ongoing work at its state-of-the-art R&D centers, Henkel aims to accelerate the time-to-market of its semiconductor packaging materials through strategic relationships between industry, government and the academia. CITC, which collaborates with leading electrical and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high thermal temperature die attach formulations as a catalyst for device design. advanced devices.
New die attach technology has the potential to enable replacement of lead in RF and power semiconductor devices that incorporate a larger die on copper leadframes, enabling the introduction of power die technologies gallium nitride and silicon carbide at high operating temperature. Many CITC partners are actively integrating these new chip structures, making the cooperative project an excellent testing ground for Henkel’s zero-pressure sintering platform.